St Microelectronics | The Plan
  1. Home
  2. Magazine 2002
  3. The Plan 002
  4. St Microelectronics

St Microelectronics

A.M.A. Group

Europa | Ginevra

The Geneva headquarters of ST Microelectronics has a mechanically-ventilated double skin facade called Permasteelisa Interactive Wall®.
Opting for a highly transparent building envelope means that occupant comfort and energy consumption become top priority concerns from the earliest stage of design. Intelligent application of shading devices will enable the building envelope to act as a filter between indoor and outdoor environments, letting in as much daylight as possible, while reducing solar gains as required.
Permasteelisa’s Blue Technology® provides an integrated design approach: building envelope and  environmental systems are part of a single synergic solution, providing transparency without jeopardising occupant comfort and energy consumption. Moreover, buildings costs are the same as for a similar building with conventional technology.
Double skin facades are an...

Paper Version Sold Out
4.49 €

© Maggioli SpA • THE PLAN • Via del Pratello 8 • 40122 Bologna, Italy • T +39 051 227634 • P. IVA 02066400405 • ISSN 2499-6602 • E-ISSN 2385-2054